QFN (Quad Flat No-lead) packaging method of power conversion module

• Main Author: LU JINFA
• Format: Patent
• Language: Chinese; English
• Published: 03.02.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The invention relates to the technical field of QFN packaging, discloses a QFN packaging method for a power conversion module, and solves the problems that the internal heat conduction effect of an existing QFN packaging structure is poor, and short circuit and unstable connection are easily caused when the existing QFN packaging structure is connected with a PCB, and the QFN packaging structure comprises a power conversion module PCB and a plurality of QFN packaging bodies, the QFN packaging body is composed of a packaging base, a chip seat, a chip and a plastic packaging body, a plurality of first pins are arranged on the side edge of the top end of the packaging base, a plurality of second pins are arranged on the side edge of the top end of the chip, and the first pins and the second pins are connected through metal wires; according to the power conversion module with the QFN packaging structure, the internal heat conduction effect can be improved, heat on the chip can be quickly dissipated, the connectio