Plasma with symmetric and irregular shape using modular microwave sources
Embodiments include a plasma processing tool including a processing chamber, and a plurality of modular microwave sources coupled to the processing chamber. In one embodiment, the plurality of modular microwave sources includes an array of applicators disposed on a dielectric body that forms a porti...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
03.02.2023
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Subjects | |
Online Access | Get full text |
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Summary: | Embodiments include a plasma processing tool including a processing chamber, and a plurality of modular microwave sources coupled to the processing chamber. In one embodiment, the plurality of modular microwave sources includes an array of applicators disposed on a dielectric body that forms a portion of an outer wall of the processing chamber. The array of applicators may be coupled to the dielectric body. In addition, the plurality of modular microwave sources may include an array of microwave amplification modules. In one embodiment, each microwave amplification module may be coupled to at least one of the applicators in an array of applicators. According to one embodiment, the dielectric body is planar, non-planar, symmetric, or asymmetric. In yet another embodiment, the dielectric body may include a plurality of recesses. In this embodiment, at least one applicator may be disposed in at least one of the recesses.
实施方式包含:等离子体处理工具,所述等离子体处理工具包含:处理腔室,及被耦接至该处理腔室的多个模块化微波源。在一实施方式中,该多个模块化微波源包含:施加器的阵列,所述施加器被设置在介电 |
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Bibliography: | Application Number: CN202211292228 |