Probe card structure and probe card testing method

• Main Authors: DENG PAN, LI SHENGZI, JI MING, CUI PENG
• Format: Patent
• Language: Chinese; English
• Published: 03.02.2023
• Subjects: MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; TESTING

The invention provides a probe card structure and a probe card testing method. Wherein the probe card structure is arranged opposite to the wafer table and comprises three layers of top components, a PCB (Printed Circuit Board) and probes which are sequentially arranged, the top components are arranged above the PCB through ceramics, and the probes are arranged below the PCB through epoxy resin; the probe card structure further comprises a gas gathering ring which is additionally arranged at the ceramic position in the inner ring direction of the probe and extends towards the direction of the wafer table. A plurality of air holes penetrating through the PCB are formed in the periphery of the epoxy resin corresponding to the probes; arranging a gas gathering wall at the periphery of the gas hole; nitrogen passes through a main airflow hole penetrating through the PCB between the probes through a gas bin in the top assembly and is restrained by a gas gathering ring to be blown to the direction of a wafer table.