Lead-free brass alloy and use thereof

The invention relates to a lead-free brass alloy containing 57.0 to 60.0% Cu, 1.0 to 2.0% Al, 1.5 to 2.5% Mn, 0.1 to 1.0% Fe, up to 0.5% Ni, up to 0.5% Sn, 0.5 to 2.0% Si, less than 0.1% Pb, the balance Zn and unavoidable impurities, the copper equivalent (CuEq) being in the range of 52.0 to 58.0%,...

Full description

Saved in:
Bibliographic Details
Main Authors SOHY FRIEDRICH, BRAUTIGAM, VOLKER, DEHNELT ANDREAS
Format Patent
LanguageChinese
English
Published 03.02.2023
Subjects
ALLOYS
CHEMISTRY
FERROUS OR NON-FERROUS ALLOYS
METALLURGY
TREATMENT OF ALLOYS OR NON-FERROUS METALS
Online AccessGet full text

Cover

More Information
Summary:The invention relates to a lead-free brass alloy containing 57.0 to 60.0% Cu, 1.0 to 2.0% Al, 1.5 to 2.5% Mn, 0.1 to 1.0% Fe, up to 0.5% Ni, up to 0.5% Sn, 0.5 to 2.0% Si, less than 0.1% Pb, the balance Zn and unavoidable impurities, the copper equivalent (CuEq) being in the range of 52.0 to 58.0%, and the use thereof. 本发明涉及无铅黄铜合金及其用途，该合金含有57.0至60.0％Cu、1.0至2.0％Al、1.5至2.5％Mn、0.1至1.0％Fe、至多0.5％Ni、至多0.5％Sn、0.5至2.0％Si、小于0.1％Pb，余量的Zn以及不可避免的杂质，其中铜当量(CuEq)在52.0至58.0％范围内。
Bibliography:Application Number: CN202210847932