Improved method for manufacturing electro-acoustic module
Embodiments of the present disclosure relate to an improved method for manufacturing an electro-acoustic module. A method for manufacturing an electro-acoustic module includes forming an assembly having a redistribution structure and a plurality of dies arranged in a dielectric region; forming a waf...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
03.02.2023
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Subjects | |
Online Access | Get full text |
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