Improved method for manufacturing electro-acoustic module

• Main Authors: SHAW MICHAEL ALAN, DEL SARTO MARCO
• Format: Patent
• Language: Chinese; English
• Published: 03.02.2023
• Subjects: MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; TRANSPORTING

Embodiments of the present disclosure relate to an improved method for manufacturing an electro-acoustic module. A method for manufacturing an electro-acoustic module includes forming an assembly having a redistribution structure and a plurality of dies arranged in a dielectric region; forming a wafer having a semiconductor body and a plurality of respective laterally interleaved unit portions, each of the unit portions including a respective support region disposed in contact with the semiconductor body and a plurality of actuators; the thickness of the semiconductor body is reduced and then a portion of the semiconductor body is selectively removed so as to singulate a plurality of transduction structures starting from the wafer, each comprising a semiconductor substrate that contacts a corresponding support region and is passed through by a cavity, the cavity is defined by a part forming a supporting area of the membrane mechanically coupled with the actuator; the transduction structure is then coupled to