Temperature control unit and method for manufacturing temperature control unit

• Main Author: MORIUCHI HIDEKI
• Format: Patent
• Language: Chinese; English
• Published: 31.01.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

A temperature adjustment unit (10) according to the present invention has a plurality of rod-like members (32, 34) extending parallel to each other at intervals and connecting members (24, 26) connecting the rod-like members (32, 34), and is configured by laminating a plurality of metal porous structures (for example, metal fiber structures (40, 42)) formed from metal, the rod-like members (32, 34) of each metal porous structure extending parallel to each other, and the rod-like members (32, 34) of each metal porous structure extending parallel to each other. A fluid flow path (50) is formed in a gap between the rod-shaped members (32, 34). 本发明的温度调节单元(10)具有隔开间隔相互平行地延伸的多个棒状部件(32、34)以及连接各棒状部件(32、34)的连接部件(24、26)，通过叠层多个由金属形成的金属多孔质结构体(例如，金属纤维结构体(40、42))构成，各金属多孔质结构体的各棒状部件(32、34)相互平行地延伸，在各棒状部件(32、34)之间的间隙中形成流体的流路(50)。