Wafer bearing device of heat treatment equipment

• Main Authors: MA BAILING, MA LAN, OH SEUNG-AM, YANG FENG
• Format: Patent
• Language: Chinese; English
• Published: 31.01.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a wafer bearing device of heat treatment equipment, which comprises at least one carrying disc movably arranged in the heat treatment equipment, a wafer groove arranged on the upper side of the carrying disc, and a plurality of through holes arranged on the carrying disc; the jacking structure is arranged below the carrying disc, and the jacking structure can be driven by the telescopic driving component to ascend and descend; the top tray is movably arranged between the jacking structure and the carrying tray; the lower ends of the multiple guide columns are connected with the top disc, the upper end of each guide column movably penetrates through one through hole, a positioning piece is arranged on the end face of the upper end of each guide column and is in a conical table shape with the upper end diameter smaller than the lower end diameter, the lower end diameter of each positioning piece is smaller than the diameter of each guide column, and the positioning pieces and the guide co