Machining method and machining device for hemispherical thin-wall housing parts with different thicknesses

• Main Authors: LIU DELIANG, WU HAONAN, CHEN JIE, QIAN LIPENG, WU PENGCHENG, SHEN XIAOLI, CHOI JUN-YOUNG, LIU YONGZHE, MENG LIQIN, WANG DU
• Format: Patent
• Language: Chinese; English
• Published: 31.01.2023
• Subjects: COMBINED OPERATIONS; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; OTHER WORKING OF METAL; PERFORMING OPERATIONS; TRANSPORTING; UNIVERSAL MACHINE TOOLS

The invention discloses a machining method and a machining device for a semispherical thin-wall housing part with different thicknesses. The machining method comprises the following steps: a blanking step: selecting and machining a circular thin-plate blank according to the maximum wall thickness and the unfolding size of the semispherical thin-wall housing part with different thicknesses; a stamping step: loading the round sheet blank material into a stamping concave die of a stamping clamp, and stamping the round sheet blank material through a stamping convex die of the stamping clamp arranged on a punch of a punch press to form a semi-finished curved-surface blank material; and a lathe machining step, wherein after the semi-finished curved-surface blank is fixed through a turning clamp, the semi-finished curved-surface blank is machined through a lathe to sequentially form the end face, the inner curved surface and the outer curved surface of the semi-spherical thin-wall housing part with the different thi