Package-on-package structure and manufacturing method thereof

• Main Authors: HE MINGJIAN, YANG RIGUI, YU GONGCHI
• Format: Patent
• Language: Chinese; English
• Published: 17.01.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to a laminated packaging structure and a manufacturing method thereof. The manufacturing method comprises the following steps: providing a first printed circuit board and a second printed circuit board; interconnection metal columns are provided and comprise a top metal column, at least one middle metal column and a bottom metal column which are integrally formed from top to bottom, the diameter of the top metal column is larger than that of the middle metal column directly adjacent to the top metal column, and the diameter of the bottom metal column is larger than that of the middle metal column directly adjacent to the bottom metal column; welding the end part of the top metal cylinder to a bonding pad on the first printed circuit board, and welding the end part of the bottom metal cylinder to a bonding pad on the second printed circuit board; and filling a plastic package material between the first printed circuit board and the second printed circuit board, so that the plastic package