Lead scandium tantalate surface copper plating process for electrocaloric refrigeration system

• Main Author: QIAN JIANMIN
• Format: Patent
• Language: Chinese; English
• Published: 17.01.2023
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The invention discloses a lead scandium tantalate surface copper plating process for an electrocaloric refrigeration system. The lead scandium tantalate surface copper plating process comprises the following steps: step 1, chemical degreasing; step 2, ultrasonic cleaning; step 3, surface roughening; step 4, surface sensitization; 5, chemical nickel plating; step 6, chemical copper plating; before copper plating, the surface of the ceramic material is subjected to oil removal treatment by utilizing an oil removal agent, oil stains on the surface are preliminarily removed, then ultrasonic cleaning is performed by utilizing an ultrasonic cleaning machine, the oil stains and dust on the surface of the ceramic material are effectively removed, and the copper plating effect is favorably improved; before copper plating, a roughening solution and a sensitizing solution are used for soaking the surface of the lead scandium tantalate ceramic, so that the surface roughness of the ceramic material is effectively improved