Component crimping device and method for controlling component crimping device

• Main Author: KATANO, RYOUICHIROU
• Format: Patent
• Language: Chinese; English
• Published: 13.01.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a component crimping device and a control method of the component crimping device, which can restrain reduction of installation precision. A component crimping device (100) is provided with: a substrate holding unit (110) having a holding surface for holding a substrate in a state in which an end of a component to be crimped protrudes; a back support part (120) which is provided with an adsorption surface that adsorbs the end part from below the substrate; an adsorption mechanism (130) for generating an adsorption force on the adsorption surface; a crimping part (150) which crimps the part from the upper part of the substrate to the end part which is absorbed by the back support part; a position changing unit (140) that changes the relative position of the back support unit and the substrate holding unit; and a control unit (170). The control unit causes the position changing unit to change the relative position to a first relative position in which the holding surface is positioned abo