High-temperature creep life prediction method based on creep deformation mechanism

• Main Authors: HE YANMING, WANG PENG, LYU CHUANYANG, YANG JIANGUO, GAO ZENGLIANG
• Format: Patent
• Language: Chinese; English
• Published: 10.01.2023
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; TESTING

The invention provides a high-temperature creep life prediction method based on a creep deformation mechanism, and the method comprises the steps: carrying out creep fracture tests of different stress levels on a material at different test temperatures; according to a creep fracture test, establishing a function relationship among the steady state/minimum creep strain rate, the stress sigma and the temperature T, and recording the function relationship as a formula 1; according to the formula 1, obtaining a relationship of the creep strain epsilon changing along with the creep time t, and recording the relationship as a formula 2; obtaining a calculation formula of the creep fracture time tr according to a formula 2; the grain size influence is considered, and the corrected creep fracture time tr'is obtained; a ductility depletion method is corrected by taking the strain at the 90% fracture life as the creep ductility, and the relationship of the creep strain epsilon 0.9 is obtained; and obtaining a creep lif