High-performance high-entropy alloy material and preparation method
The invention provides a high-performance high-entropy alloy material and a preparation method, and belongs to the field of metal material processing. According to the method, the material is prepared through the accumulative roll bonding technology, the high-entropy alloy with the uniform and fine...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
06.01.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The invention provides a high-performance high-entropy alloy material and a preparation method, and belongs to the field of metal material processing. According to the method, the material is prepared through the accumulative roll bonding technology, the high-entropy alloy with the uniform and fine grain structure can be obtained, and the strength and plasticity of the high-entropy alloy can be improved at the same time. However, the side surface of the accumulative roll-bonding high-entropy alloy plate is most likely to have defects or layer-to-layer separation in the using process, laser melting treatment is conducted on the side surface of the plate in the thickness direction after roll-bonding, so that the roll-bonding plate can be fully fused, the strength of the side surface can be improved, and the service life of the side surface is prolonged. And it is guaranteed that the ply-rolled plates cannot be separated when deforming. And then the high-entropy alloy plate material is obtained through small-def |
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Bibliography: | Application Number: CN202211106628 |