Packaging structure and forming method thereof

A package structure and a method of forming the same are provided. The method includes disposing a chip structure over a substrate. The chip structure is provided with an inclined side wall, the inclined side wall and a vertical direction form an acute angle, the vertical direction is a direction ve...

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Bibliographic Details
Main Authors LIAO LILING, LIN BAIYAO, YANG ZHEJIA, YE SHUSHEN, LAI BAICHEN, ZHENG XINPU
Format Patent
LanguageChinese
English
Published 03.01.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A package structure and a method of forming the same are provided. The method includes disposing a chip structure over a substrate. The chip structure is provided with an inclined side wall, the inclined side wall and a vertical direction form an acute angle, the vertical direction is a direction vertical to the main surface of the chip structure, and the acute angle is between about 12 degrees and about 45 degrees. The method further includes forming a protective layer around the chip structure. 提供了一种封装结构及其形成方法。方法包括在一基板之上设置一芯片结构。芯片结构具有一倾斜侧壁，倾斜侧壁与一垂直方向成一锐角，垂直方向为垂直于芯片结构主表面的方向，且锐角介于约12度至约45度之间。方法更包括形成一保护层以围绕芯片结构。
Bibliography:Application Number: CN202210921593