Semiconductor device, transistor and method of forming semiconductor device
Embodiments include a semiconductor device, a transistor, and a method of forming a semiconductor device, such as a nanoFET transistor including a first nanostructure. A gate dielectric is formed around the first nanostructure. A gate electrode is formed over the gate dielectric, and the gate electr...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
27.12.2022
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Subjects | |
Online Access | Get full text |
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Summary: | Embodiments include a semiconductor device, a transistor, and a method of forming a semiconductor device, such as a nanoFET transistor including a first nanostructure. A gate dielectric is formed around the first nanostructure. A gate electrode is formed over the gate dielectric, and the gate electrode includes a first work function metal. In the gate electrode, a first metal residue is formed at an interface between the gate dielectric and the first work function metal due to a processing process performed prior to forming the first work function metal. The first metal residue has a metal element different from a metal element of the first work function metal.
实施例包括一种半导体装置、晶体管、以及形成半导体装置的方法,诸如包括第一纳米结构的纳米FET晶体管。栅极介电质在第一纳米结构周围形成。栅极电极在栅极介电质上方形成,并且栅极电极包括第一功函数金属。在栅极电极中,由于在形成第一功函数金属之前执行的处理制程,第一金属残留物在栅极介电质与第一功函数金属之间的界面处形成。第一金属残留物具有与第一功函数金属的金属元素不同的金属元素。 |
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Bibliography: | Application Number: CN202210325940 |