Piezoelectric MEMS hydrophone with pressure-resistant structure
The invention belongs to the technical field of hydrophones, discloses a piezoelectric MEMS hydrophone with a pressure-resistant structure, and aims to solve the problem of poor pressure resistance of the conventional piezoelectric MEMS hydrophone. The hydrophone comprises a sound transmission shell...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
23.12.2022
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Subjects | |
Online Access | Get full text |
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Summary: | The invention belongs to the technical field of hydrophones, discloses a piezoelectric MEMS hydrophone with a pressure-resistant structure, and aims to solve the problem of poor pressure resistance of the conventional piezoelectric MEMS hydrophone. The hydrophone comprises a sound transmission shell, a substrate, an SOI layer and a sensing layer. A liquid filling area is formed between the sound transmission shell and a whole formed by the substrate, the SOI layer and the sensing layer; the sensing layer comprises a plurality of sensing units; back cavities are formed in the positions, corresponding to the sensing units, of the back face of the SOI layer; the back surface of the SOI layer is also provided with a micro-channel for communicating the liquid filling area and each back cavity; the back cavity is filled with air, the liquid filling area is filled with liquid, and the micro-channel, the back cavity, the sensing layer and the liquid in the liquid filling area jointly form a pressure-resistant hydrost |
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Bibliography: | Application Number: CN202211429911 |