Immersed direct cooling module and related methods

• Main Authors: JEON OSEOB, IM SEUNG-WON, TISAYER, JU RG, GAO YINGXIAN, SEDDON MICHAEL J
• Format: Patent
• Language: Chinese; English
• Published: 16.12.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to submerged direct cooling modules and related methods. Embodiments of a semiconductor package may include one or more semiconductor dies coupled only directly to a direct leadframe attachment (DLA) leadframe including two or more leads; and a coating covering the one or more semiconductor dies and the DLA leadframe, where the coating is contactable with a dielectric coolant while the two or more leads extend out of an immersion cooling housing when the semiconductor package is coupled into the immersion cooling housing. 本公开涉及浸没式直接冷却模块及相关方法。半导体封装的实施方式可包括一个或多个半导体管芯，该一个或多个半导体管芯仅直接耦接到包括两条或更多条引线的直接引线框附接(DLA)引线框；以及涂层，该涂层覆盖该一个或多个半导体管芯和该DLA引线框，其中当该半导体封装耦接到浸没式冷却壳体中时，该涂层可与介电冷却剂接触，而该两条或更多条引线延伸出该浸没式冷却壳体。