Bottom purge for semiconductor processing systems
An example substrate processing system may include a plurality of processing regions. The system may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. The system may include a plurality of substrate supports, and each substrate suppo...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
06.12.2022
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Subjects | |
Online Access | Get full text |
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Summary: | An example substrate processing system may include a plurality of processing regions. The system may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. The system may include a plurality of substrate supports, and each substrate support of the plurality of substrate supports may be vertically translated between a transfer region and an associated processing region of the plurality of processing regions. The system may include a transfer device including a rotatable shaft extending through a transfer region housing. The transfer device may include an end effector coupled with the rotatable shaft. The end effector may include a central hub defining a central bore fluidly coupled with a purge source. The terminal effector may also include a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports.
示例性基板处理系统可以包括多个处理区域。所述系统可以包括限定与多个处理区域流体耦合的转移区域的转移区域外壳。所述系统可以包括多个基板支撑件,并且多个基板支撑件中的每个基板支撑件 |
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Bibliography: | Application Number: CN202180030923 |