Semiconductor wafer film pasting device and film pasting method thereof

• Main Author: LU JINFA
• Format: Patent
• Language: Chinese; English
• Published: 02.12.2022
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The invention relates to an integrated circuit packaging technology, in particular to a semiconductor wafer film pasting device and a film pasting method thereof.The semiconductor wafer film pasting device comprises a workbench, a conveying mechanism is arranged on the workbench, a plurality of material carrying plates are arranged on the conveying mechanism, wafers are arranged on the material carrying plates, and a film covering box is further arranged on the workbench; a film feeding assembly and a film collecting assembly are arranged on the front side and the rear side of the workbench, and the controller is used for controlling the conveying mechanism to drive the material carrying plate to move rightwards and penetrate through the film covering box. A film covering assembly is arranged in the film covering box, the film covering assembly comprises a film supporting barrel and an annular cutting cover, the film supporting barrel is sleeved with the annular cutting cover, a certain distance is kept betwe