SUBSTRATE DIVIDING APPARATUS AND DIVIDING CONTROL METHOD

• Main Authors: ZHANG XIANGDONG, YOU WENTAO, DOU HAIDONG, GUO SHIBO
• Format: Patent
• Language: Chinese; English
• Published: 02.12.2022
• Subjects: COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; TRANSPORTING

The invention provides a substrate cutting device and a cutting control method, the substrate cutting device comprises a force measuring sensor, a cutting tool and a fixing part, the force measuring sensor and the cutting tool are respectively connected with the fixing part, and the force measuring sensor is used for measuring the resistance of the cutting tool along a first direction; the method comprises the following steps: calculating the cutting torque of the cutting tool based on resistance measured by a force transducer, and obtaining the working current of the cutting tool; comparing the cutting moment with a first moment threshold; comparing the working current with a current threshold; when the cutting torque is larger than a first torque threshold value or the working current is larger than a current threshold value, one of the following operations is executed on the cutting tool: reducing the moving speed of the cutting tool; the cutting tool is fed; tool changing operation is carried out on the c