Printed circuit board (PCB) ink layer forming method

The embodiment of the invention provides a printed circuit board (PCB) ink layer forming method, which comprises the following steps of: providing a mother board, and pre-forming a circuit copper layer with the thickness of greater than or equal to 2.4 mil on the surface of the mother board; forming...

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Bibliographic Details
Main Authors MEI ZHENGZHONG, LUO JIALIANG, LIN ZHUOHUI
Format Patent
LanguageChinese
English
Published 29.11.2022
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The embodiment of the invention provides a printed circuit board (PCB) ink layer forming method, which comprises the following steps of: providing a mother board, and pre-forming a circuit copper layer with the thickness of greater than or equal to 2.4 mil on the surface of the mother board; forming an ink layer on the surface of the mother board by adopting a silk-screen process; within 10 minutes after the printing ink layer is formed through silk-screen printing, the mother board is put into bubble removing equipment to be subjected to bubble removing treatment till no bubble overflows from the printing ink layer within a preset time period; and exposing and developing the ink layer on the surface of the mother board subjected to bubble removal. According to the embodiment of the invention, the mother board is put into the bubble removal equipment for bubble removal treatment within 10 minutes after the ink layer is subjected to silk-screen printing, so that bubbles existing in the ink layer are effectivel
Bibliography:Application Number: CN202211064610