MULTILAYER CIRCUIT SUBSTRATE BY JOINING AND METHOD FOR MANUFACTURING SAME

• Main Authors: PARK JONG KEUN, XU HUAQIANG ERIC, KIM CHUNG-HYUN, PARK DOO-HWAN, KIM SUNG-JUN, PARK KUM-SUN
• Format: Patent
• Language: Chinese; English
• Published: 29.11.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The multilayer circuit board may include: a ceramic substrate portion; a unit circuit board coupled to one surface of the ceramic substrate portion, the unit circuit board including: an insulating layer having a circuit pattern formed on one surface thereof; the bonding layer is bonded on the other surface of the insulating layer; a via hole penetrating through the insulating layer and the adhesive layer and connected with one side of the circuit pattern; and the conductive paste is filled in the via hole. The method for manufacturing a multi-layer circuit board according to a one-step bonding method may comprise: a step for manufacturing a circuit board section including a plurality of unit circuit boards; a step of providing a ceramic substrate part; and a step of bonding the circuit substrate part and the ceramic substrate part together. The step of manufacturing each unit circuit substrate may include: a step of providing an insulating layer having a circuit layer formed on one surface thereof; a step of