Packaging structure of device

• Main Authors: ZHANG JIAJIA, SHAO XINGJIE, GONG ZIXIONG, LIU JIE, FU CHAO, DENG MENG
• Format: Patent
• Language: Chinese; English
• Published: 22.11.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The embodiment of the invention provides a packaging structure of a device. The packaging structure comprises a copper substrate, an airtight layer, an epoxy molding compound and pins, the pins and the epoxy molding compound are connected with the copper substrate; an accommodating groove is formed in the epoxy molding compound; a notch of the accommodating groove faces the copper substrate; the epoxy molding compound is provided with an outer leading opening for the pin to extend into the accommodating groove; the containing groove is filled with an airtight layer. The airtight layer is arranged in the containing groove of the epoxy molding compound, the airtight layer in the containing groove can completely cover the internal pin in the containing groove in an attached mode, and the airtight layer can block the gap between the pin and the epoxy molding compound. The gaps between the pins and the epoxy molding compound are blocked, so that water vapor is difficult to enter the device through the gaps, and th