Halogen-free hot stamping glue for alumite and preparation method thereof

The invention relates to the field of C09J157/00 of IPC classification, in particular to halogen-free hot stamping glue for alumite and a preparation method of the halogen-free hot stamping glue. The hot stamping glue comprises the following raw materials in percentage by mass: 20-30% of polymer mod...

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Bibliographic Details
Main Authors HE WENHAO, LYU XINGJUN, YAN CHANGQI, HUANG ZHAO, CAO XUEFENG, GUO JUNFA
Format Patent
LanguageChinese
English
Published 18.11.2022
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Summary:The invention relates to the field of C09J157/00 of IPC classification, in particular to halogen-free hot stamping glue for alumite and a preparation method of the halogen-free hot stamping glue. The hot stamping glue comprises the following raw materials in percentage by mass: 20-30% of polymer modified resin, 0.1-1% of rubber base material, 1-3% of acrylic resin, 10-20% of tackifying resin, 3-5% of inorganic filler and the balance of organic solvent. The prepared hot stamping glue has good multi-material adhesion, fluidity and curing strength, the service life of the cured hot stamping glue is effectively prolonged, halogen and non-halogen adhesion promoters in any form are not used, and the hot stamping glue is suitable for being popularized in the field of hot stamping glue and has wide development prospects. 本发明涉及IPC分类的C09J157/00领域,尤其涉及一种电化铝用无卤热烫印胶水及其制备方法。热烫印胶水的原料包含以下成分,以质量百分比计:高分子改性树脂20~30%,橡胶基料0.1~1%,丙烯酸类树脂1~3%,增粘树脂10~20%,无机填料3~5%,有机溶剂补充余量。本申请制得的烫印胶水具有良好的多材质附着力,流动性和固化强度,并且有效提高了固化后烫印胶水的使用寿命,且未使用任何形式的卤素和
Bibliography:Application Number: CN202111293949