Semiconductor wafer die bonding device

• Main Author: LU JINFA
• Format: Patent
• Language: Chinese; English
• Published: 18.11.2022
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

The invention discloses a semiconductor wafer die bonding device. The device comprises a support frame; the two end face polishing devices are used for polishing the end faces of the wafers, and one end face polishing device is detachably arranged on the supporting frame and can rotate on the supporting frame; the side face polishing device is used for fixing the wafer and polishing the side face of the wafer, and the side face polishing device is detachably arranged on one end face polishing device and can rotate on the end face polishing device; a plurality of bolts are arranged on the connecting frame, and the bolts are detachably connected with the end face grinding device and the side face grinding device; the electric driving device is used for driving the connecting frame to rotate; the pneumatic driving device is arranged on the supporting frame and used for driving the electric driving device to move up and down; the device comprises three resistors, three relays, three protective resistors, three ti