Light-emitting diode packaging structure, manufacturing method thereof and light-emitting panel

• Main Authors: ZHAN ZHIZHU, XIE HAOLUN, SUN SHUOYANG, LI XIAOYUN, CHEN FUYANG, WANG YOUZHI, ZHANG YUHAO, LAI YINGHUI
• Format: Patent
• Language: Chinese; English
• Published: 15.11.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a light-emitting diode packaging structure, a manufacturing method of the light-emitting diode packaging structure and a light-emitting panel. The light-emitting diode packaging structure comprises a first insulating layer, a first conductive pattern, a second insulating layer, a second conductive pattern, a light-emitting diode element and solder. The first conductive pattern is provided with a first part and a second part, the first part is filled in the through hole of the first insulating layer, and the second part is arranged on the first insulating layer and is connected with the first part; the second insulating layer is arranged on the first insulating layer and covers the first conductive pattern. The second portion of the first conductive pattern is sandwiched between the first insulating layer and the second insulating layer. The second conductive pattern is disposed on the second insulating layer and electrically connected to the first conductive pattern. The light emitting