Cutter and polishing device

• Main Authors: WANG HENG, XIA YUERONG, CHANG XIANWEI, XIAO TAO
• Format: Patent
• Language: Chinese; English
• Published: 15.11.2022
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

The invention discloses a cutter and a polishing device, the cutter comprises at least two mounting parts, a transmission shaft and a cutter shaft, the two adjacent mounting parts are arranged at intervals, the transmission shaft penetrates through the mounting parts and drives the mounting parts to rotate, a blade penetrates through the cutter shaft, the cutter shaft is eccentrically arranged relative to the transmission shaft, and the cutter shaft is in sliding fit with the mounting parts; the cutter shaft can at least move in the direction close to or away from the transmission shaft. The blade can be used for grinding work, the cutter shaft can move close to or away from the transmission shaft, when the installation piece rotates along with the transmission shaft, the cutter shaft and the blade are subjected to centrifugal force, the cutter shaft moves in the direction away from the transmission shaft, when the blade makes contact with a hard material, the blade and the cutter shaft are subjected to impac