Chip module

• Main Authors: H.-G. MENSCH, D. HOUDEAU, J. KIRSCHBAUER
• Format: Patent
• Language: Chinese; English
• Published: 09.06.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; BOOK COVERS; BOOKBINDING; CALCULATING; COMPUTING; COUNTING; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILES; HANDLING RECORD CARRIERS; LOOSE LEAVES; MOVABLE-STRIP WRITING OR READING APPARATUS; PERFORMING OPERATIONS; PHYSICS; PRESENTATION OF DATA; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR; RECOGNITION OF DATA; RECORD CARRIERS; SEMICONDUCTOR DEVICES; SPECIAL PRINTED MATTER; TRANSPORTING

为了避免在热-熔化构成方法中在覆盖物和芯片之间分层，建议针对在芯片模块中从外部馈入的热流进行控制。根据本发明，这或者通过绝热层(9)，它置放在芯片模块的可弯曲的支架纽带(2)和粘贴在此上的芯片(3)之间，或者通过在金属触点(10)的平面或表层范围内的空隙(11)实现，因此阻止了安放在金属触点(10)外部范围内的空心立柱(10)的热量流向安装在中心的芯片(3)的方向。 The object of the invention is to prevent delamination between the covering compound and the chip in the hot-melt assembly process. According to the invention, this object is achieved in that the heat flow introduced from the exterior into the chip module is controlled in a deliberate manner, either by a heat-insulating layer (9) interposed between the flexible carrier strip (2) of the chip module and the chip (3) bonded thereon, or by recesses (11) in the surface or layer of the metal contacts (10) such that heat is prevented from flowing from a hollow stamp (1) placed in the outer region of the metal contacts (10) in the direction of the centrally-mounted chip (3).