Epoxy resin cleaning agent and application thereof

The invention discloses an epoxy resin cleaning agent which comprises the following components in percentage by weight: 5-50% of a high-boiling-point organic solvent; 0.01% to 10% of an epoxy diluent; 0.01% to 10% of a surfactant; and the balance of water. Wherein the epoxy diluent is one or more of...

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Bibliographic Details
Main Authors ZHOU KANGDI, ZHONG NA, LI LIGUI
Format Patent
LanguageChinese
English
Published 08.11.2022
Subjects
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Summary:The invention discloses an epoxy resin cleaning agent which comprises the following components in percentage by weight: 5-50% of a high-boiling-point organic solvent; 0.01% to 10% of an epoxy diluent; 0.01% to 10% of a surfactant; and the balance of water. Wherein the epoxy diluent is one or more of alkylene glycidyl ether, ethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, butyl glycidyl ether, 1, 4-butanediol diglycidyl ether, benzyl glycidyl ether, o-tolyl glycidyl ether and C12-14 aliphatic glycidyl ether. The invention further discloses application of the epoxy resin cleaning agent, and the epoxy resin cleaning agent serves as the epoxy resin cleaning agent in the manufacturing process of electronic components, optoelectronic devices and printed circuit boards. The epoxy resin cleaning agent disclosed by the invention is green and environment-friendly, has a good cleaning effect and small corrosivity, and is particularly suitable for being used as a cleaning agent for precision devi
Bibliography:Application Number: CN202211161642