Nozzle cleaning ring

• Main Authors: STRENG BRADLEY TAYLOR, SINGH, SUMEET, SUDHAKAR
• Format: Patent
• Language: Chinese; English
• Published: 04.11.2022
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

Methods, systems, and computer programs are directed to the design of a novel showerhead purge ring for a semiconductor manufacturing apparatus. The showerhead sweeping ring includes a top portion and a bottom portion coupled to and concentric with the top portion. The top portion has a hollow center for directing a process gas and an inlet for a purge gas on a side of the top portion. The bottom portion has a hollow center to direct process gas to the showerhead. A plenum that directs purge gas is defined within the showerhead purge ring, and the bottom portion includes an aperture for venting purge gas above the showerhead. 方法、系统和计算机程序针对用于半导体制造装置的新型喷头清扫环的设计。该喷头清扫环包括顶部部分和底部部分，底部部分耦合到顶部部分并与顶部部分同心。顶部部分具有用于引导工艺气体的中空中心和位于顶部部分的侧面的用于清扫气体的入口。底部部分具有中空中心，以将工艺气体导向喷头。引导清扫气体的充气室限定在喷头清扫环内，并且底部部分包括用于排出喷头上方的清扫气体的孔。