Heat treatment apparatus and heat treatment method

• Main Authors: ONIZUKA TOMOYA, KAWAKAMI SHINICHIRO, SANO YOHEI
• Format: Patent
• Language: Chinese; English
• Published: 01.11.2022
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES

Provided is a technique capable of promoting a change in solubility when heat-treating a substrate on the surface of which an exposed resist having a portion exposed or a portion unexposed by reacting with water and being heated changes in solubility with respect to a developing solution is formed. To this end, the heat treatment apparatus is provided with: a mounting table (23) on which the substrate (W) is mounted and heated; a lifting mechanism (26) that relatively lifts the substrate (W) between a first position at which the substrate (W) is placed on the mounting table (23) and a second position at which the substrate (W) is separated from the mounting table; and a gas supply unit (33) that supplies a first gas, the humidity of which is higher than the humidity of the atmosphere in which the mounting table (23) is provided, to the substrate (W) positioned at the second position before the substrate (W) is moved to the first position. 提供一种在对表面形成有通过与水反应并被加热而曝光部或未曝光部的相对于显影液的溶解性发生变化的已曝光的抗蚀剂的基板进行热处理时能够促进该溶解性的