Semiconductor package with electromagnetic interference shielding

• Main Authors: CHEN JIE, WAN LIANG, MURUGAN RAMANATHAN M, TANG YIQI
• Format: Patent
• Language: Chinese; English
• Published: 01.11.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The embodiment of the invention relates to a semiconductor package with electromagnetic interference shielding. In one embodiment, a semiconductor package includes a multi-layer package substrate including a first layer including a first dielectric layer and a first metal layer, the first metal laye...