Semiconductor package with electromagnetic interference shielding

• Main Authors: CHEN JIE, WAN LIANG, MURUGAN RAMANATHAN M, TANG YIQI
• Format: Patent
• Language: Chinese; English
• Published: 01.11.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The embodiment of the invention relates to a semiconductor package with electromagnetic interference shielding. In one embodiment, a semiconductor package includes a multi-layer package substrate including a first layer including a first dielectric layer and a first metal layer, the first metal layer including a first metal trace; and a second layer including a second dielectric layer. An integrated circuit (IC) die includes a bond pad, wherein a bottom side of the IC die is attached to the first metal trace. A metal guide pillar is connected to the first metal trace through the second dielectric layer. A third layer on the second layer includes: a third dielectric layer on the second layer extending to a bottom side of the semiconductor package; and a second metal layer including a second metal trace, the second metal trace including an inner second metal trace connected to the bond pad and an outer second metal trace over the metal pillar; and a filled via disposed outside of a reachable contact pad, the re