SEMICONDUCTOR MODULE HAVING A BOND WIRE LOOP EXPOSED FROM A MOLDED

• Main Authors: LUNEVSKY PAVEL, NIKITIN IVAN
• Format: Patent
• Language: Chinese; English
• Published: 01.11.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present disclosure relates to a semiconductor module having a bond wire ring exposed from a molded body and a method of manufacturing the same. A semiconductor module includes: a substrate; a semiconductor die disposed on the substrate; the two ends of the first bonding wire ring are arranged on the first electrode of the semiconductor tube core and are coupled to the first electrode of the semiconductor tube core; and a molded body encapsulating the semiconductor die wherein a top portion of the at least one first bond wire loop is exposed from a first side of the molded body. 本公开内容涉及具有从模制主体暴露的键合线环的半导体模块及其制造方法。一种半导体模块包括：衬底；布置在衬底上的半导体管芯；至少一个第一键合线环，其中，第一键合线环的两端布置在半导体管芯的第一电极上并且耦合到半导体管芯的第一电极；以及包封半导体管芯的模制主体，其中，至少一个第一键合线环的顶部从模制主体的第一侧暴露。