Fan-out packaging method for enhancing heat dissipation

• Main Author: YAO DAPING
• Format: Patent
• Language: Chinese; English
• Published: 01.11.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a fan-out packaging method for enhancing heat dissipation, and relates to the field of chip packaging. According to the method, a plastic package mold specially made in advance is adopted to prepare a reconstructed epoxy resin wafer with deep grooves in the surface, and then heat convection of a chip embedded in epoxy resin is enhanced through air or other fluid; the deep groove on the back surface of the resin wafer can be filled with a high-heat-conductivity material, so that the heat conduction of the chip embedded in the resin is enhanced. According to the prepared resin wafer with the deep groove, the stress state of the reconstructed plastic package wafer can be adjusted through the preset size of the heat dissipation groove, so that the warping condition of the wafer is improved, and the packaging process quality of the reconstructed wafer is guaranteed. 本发明公开了一种增强散热的扇出封装方法，涉及芯片封装领域。本发明提出了采用预先特制的塑封模具，制备成表面有深槽的重构环氧树脂晶圆，后续通过空气或其他流体增强镶嵌在环氧树脂里芯片的热对流；也可在树脂晶圆背面的深槽里填充高导热材料，增强镶嵌在树脂里芯片的热