Package structure

• Main Authors: LIN BAIYAO, YANG ZHEJIA, YE SHUSHEN, XU JIAGUI, YOU MINGZHI, ZHENG XINPU
• Format: Patent
• Language: Chinese; English
• Published: 28.10.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A package structure includes a first conductive pad layer disposed in an insulating layer; a first under bump metallurgy structure under the insulating layer, a first region of the first under bump metallurgy structure being confined in a second region of the first conductive pad layer in a plan view; and a first conductive via disposed in the insulating layer and vertically connected to the first conductive pad layer and the first under bump metallurgy structure. 一种封装结构，包括第一导电垫层，位于绝缘层之中；第一凸块下冶金结构，位于绝缘层之下，在平面图中，第一凸块下冶金结构的第一区域受限于第一导电垫层的第二区域之中；以及第一导电导孔，位于绝缘层之中，且垂直连接至第一导电垫层及第一凸块下冶金结构。