Packaging structure and forming method thereof

• Main Authors: LIAO LILING, LI ZONGYAN, LIN BAIYAO, WANG JINHUA, LAI BAICHEN, YOU MINGZHI, ZHENG XINPU
• Format: Patent
• Language: Chinese; English
• Published: 28.10.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The disclosure provides a package structure and a method of forming the same. The package structure includes a redistribution structure and a first semiconductor die over the redistribution structure. The package structure also includes a wall structure laterally surrounding the first semiconductor die, the wall structure including a plurality of segments spaced apart from each other. The package structure also includes an underfill material between the wall structure and the first semiconductor die. The package structure also includes a molding compound encapsulating the underfill material. 本公开提出一种提供封装结构及其形成方法。封装结构包含重布线结构以及位于重布线结构之上的第一半导体裸片。封装结构还包含横向围绕第一半导体裸片的墙结构，墙结构包含彼此隔开的多个区段。封装结构还包含介于墙结构与第一半导体裸片之间的底部填充材料。封装结构还包含包覆底部填充材料的模制化合物。