Substrate support assembly with arc resistant coolant conduit

• Main Authors: SCHMIDT ANDREAS, STEPHEN D. PROUTY, GARCIA DE GORODO ALEJANDRO, NOUJAIM, ABDUL, A
• Format: Patent
• Language: Chinese; English
• Published: 25.10.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; SEMICONDUCTOR DEVICES

Semiconductor chamber components are described herein that include one or more conduits for carrying a fluid between an energized portion and a grounded portion of the chamber component, the conduits being configured to cause an arc less easily than conventional components. In one example, a semiconductor chamber component is provided that includes an energization region, a ground region, and a fluid conduit. A fluid conduit is disposed within the semiconductor chamber component and passes through the energization region and the ground region. The fluid conduit has an end-to-end resistance between 0.1 M Omega and 100 M Omega. 本文描述了半导体腔室部件，所述半导体腔室部件包括用于在腔室部件的通电部分与接地部分之间载送流体的一个或多个导管，与常规部件相比，所述导管配置成更不易引起电弧。在一个示例中，提供了一种半导体腔室部件，所述半导体腔室部件包括：通电区域、接地区域、以及流体导管。流体导管设置于半导体腔室部件内且通过通电区域和接地区域。流体导管具有在0.1MΩ至100MΩ之间的端至端电阻。