Member for semiconductor manufacturing apparatus and semiconductor manufacturing apparatus

• Main Authors: KOGA TATSUYA, NAKAGAWA, RYUNOSUKE
• Format: Patent
• Language: Chinese; English
• Published: 21.10.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY

The invention provides a member for a semiconductor manufacturing apparatus and the semiconductor manufacturing apparatus, which can reduce generation or influence of particles. Specifically, the member for a semiconductor manufacturing apparatus according to the present invention is provided with a composite structure including: a base material including a first surface and a second surface on the opposite side from the first surface; and a ceramic layer including a first portion provided so as to be exposed on the first surface of the substrate. The composite structure has a through hole extending in a first direction from the first surface toward the second surface and penetrating the base material and the ceramic layer, and the through hole has: a first hole region continuous with the surface of the first portion and inclined with respect to the first direction; a second hole region located between the second surface and the first hole region in the first direction and extending along the first direction;