Environment-friendly roughening treatment liquid suitable for copper surface and application of environment-friendly roughening treatment liquid
The invention discloses environment-friendly roughening treatment liquid suitable for a copper surface and application of the environment-friendly roughening treatment liquid, and relates to the field of printed circuit board production and processing. The roughening treatment fluid comprises the fo...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
21.10.2022
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Subjects | |
Online Access | Get full text |
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Summary: | The invention discloses environment-friendly roughening treatment liquid suitable for a copper surface and application of the environment-friendly roughening treatment liquid, and relates to the field of printed circuit board production and processing. The roughening treatment fluid comprises the following components in mass concentration: 5-65 g/L of hydrogen peroxide, 20-100 g/L of sulfuric acid, 1-10 g/L of a hydrogen peroxide stabilizer, 1-10 g/L of a surfactant, 15-60 g/L of a copper ion complexing agent, 0.2-1 g/L of a corrosion inhibitor and the balance of deionized water. According to the environment-friendly roughening treatment fluid suitable for the copper surface, different types of hydrogen peroxide stabilizers are adopted for compounding, and hydrogen peroxide can be kept stable and not cracked; the cationic surface active agent and the nonionic surface active agent are compounded, so that the biodegradable performance is improved. After the surface of the copper foil is treated, the coarsening |
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Bibliography: | Application Number: CN202211148574 |