PCB pressing process

• Main Authors: YANG BAO, WANG YUNFA, LIU DONGYONG, ZHAO YONG, ZHANG XU, ZHU RUILAN, ZHANG XUEQUAN, HUANG LIANG
• Format: Patent
• Language: Chinese; English
• Published: 18.10.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention, which belongs to the technical field of PCB processing, discloses a PCB pressing process comprising the following steps: S1, cutting: cutting a raw material according to a required size; s2, PCB lamination: sequentially placing a copper foil, a core plate layer and an upper copper foil on the PCB raw material from top to bottom; s3, laminating: laminating the PCB laminated layer obtained in the step S2 through a working box to obtain a PCB laminated plate; s4, performing inner layer pattern: performing ultraviolet exposure and development on the PCB laminated board to form a circuit; s5, inner-layer line detection: performing optical detection on the inner-layer line on the core board; s6, punching is carried out; s8, resin hole plugging, wherein the holes are filled with resin; and S9, antenatal care: carrying out final product inspection. According to the device for the PCB pressing process, PP can be cleaned and recycled in time, and cooling can be carried out faster so as to improve the pro