Method for heating welding chip by adopting heating plate

• Main Authors: CHEN GANGBIAO, HUANG ZHAOFENG, YOU YI, CHEN XUEZHI
• Format: Patent
• Language: Chinese; English
• Published: 18.10.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention belongs to the technical field of chip welding, and particularly relates to a method for heating and welding a chip by adopting a heating plate, which comprises the following steps of: A, loading the chip; b, the carrier glass is moved to a pressing plate above a heating platform; c, preparing a substrate, and moving the prepared substrate to a heating platform; d, aligning the chip with a bonding pad on the substrate; e, after alignment is completed, the pressing plate or/and the substrate are/is moved, the carrier glass and the substrate are pressed together, and the chip makes contact with the corresponding bonding pad on the substrate; f, the heating platform is heated, the bonding pad is heated to the melting point temperature of tin, and the chip is welded to the bonding pad; and G, welding is completed, and discharging is conducted. Therefore, compared with the prior art of the same kind, the method provided by the invention has the technical effects of few procedures, few equipment, smal