Wafer automatic transmission method for vertical SiC high-temperature furnace tube equipment

• Main Authors: CHEN RUOYU, HE YONGPING, ZENG GUIHUI, LIU GANG, YANG JIN
• Format: Patent
• Language: Chinese; English
• Published: 11.10.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses an automatic wafer transmission method for vertical SiC high-temperature furnace tube equipment, and the method comprises the following steps: S1, setting parameters in a control system, so as to specify the types of wafers stored in a wafer cache frame and a boat frame; s2, placing a wafer in a wafer box, and placing the wafer box on a material table; s3, according to a preset wafer type, transferring the wafer into a corresponding wafer cache frame through a manipulator; s4, the step S2 and the step S3 are repeated, and all the wafers are conveyed into a wafer cache frame; s5, according to the preset wafer placing type on the boat frame, the wafers are conveyed into the boat frame from the wafer cache frame in sequence through a mechanical arm; s6, starting the process, and waiting for the end of the process; s7, the wafers on the boat frame are conveyed back to the wafer cache frame in a first-in and second-out mode; and S8, the wafers needing to be discharged are selected in the co