Manufacturing method of printed circuit board with blind hole

• Main Authors: BAI YAXU, LI WENGUAN, KANG GUOQING, XIE LUNKUI, CHEN XIAOQING
• Format: Patent
• Language: Chinese; English
• Published: 04.10.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention relates to the technical field of circuit boards, and discloses a manufacturing method of a printed circuit board with blind holes, which comprises the following steps: providing an inner-layer core board, and manufacturing a first alignment mark on the inner-layer core board; providing an outer-layer core board, manufacturing an inner-layer circuit and a second alignment mark on one surface of the outer-layer core board, and synchronously manufacturing a blind hole window on the other surface of the outer-layer core board; pressing the inner-layer core board and the outer-layer core board to form a mother board, and enabling the blind hole window to be exposed out of the surface of the mother board; manufacturing an alignment hole according to the first alignment mark and the second alignment mark; performing laser drilling at the blind hole windowing position of the mother board according to the alignment hole so as to manufacture a blind hole in the mother board; and manufacturing an outer-la