Cooling-rate-adjustable energy-saving heat dissipation device and method for injection mold

The invention discloses an energy-saving heat dissipation device and method capable of regulating and controlling the cooling rate for an injection mold, belongs to the technical field of injection molds, and aims to solve the problem that when a heat dissipation device for an injection mold is used...

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Bibliographic Details
Main Authors NARIYOSHI, YE XIAOBING, GUO YAFENG, ZHANG WENHAO, HUANG JING
Format Patent
LanguageChinese
English
Published 04.10.2022
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Summary:The invention discloses an energy-saving heat dissipation device and method capable of regulating and controlling the cooling rate for an injection mold, belongs to the technical field of injection molds, and aims to solve the problem that when a heat dissipation device for an injection mold is used, the cooling rate cannot be automatically adjusted according to injection molding requirements. The heat dissipation device comprises a main heat dissipation frame and an auxiliary heat dissipation frame with the two ends fixedly installed at the two ends of the main heat dissipation frame correspondingly, a small water suction pump is fixedly installed on the outer wall of the middle of the outer side of the main heat dissipation frame in a communicating mode, and a plurality of cleaning assemblies are slidably arranged on the inner sides of inner cavities of the main heat dissipation frame and the auxiliary heat dissipation frame correspondingly; a temperature sensor is fixedly installed on the inner wall of an
Bibliography:Application Number: CN202210495651