SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

• Main Authors: KOSAI, KAZUKI, SHINOHARA KAZUYOSHI
• Format: Patent
• Language: Chinese; English
• Published: 30.09.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The substrate processing apparatus includes a holding unit, a liquid supply unit, a recovery unit, a circulation path, a gas supply unit, and a control unit. The holding part is used for holding a substrate. The liquid supply unit supplies a processing liquid to the first main surface of the substrate held by the holding unit. The recovery unit recovers the used processing liquid that has been used in the processing of the substrate. And a circulation path for returning the processing liquid recovered by the recovery unit to the liquid supply unit. The gas supply unit supplies gas to a second main surface of the substrate held by the holding unit, the second main surface being opposite to the first main surface. The control unit controls the liquid supply unit and the gas supply unit. The control unit supplies the gas to the second main surface when the predetermined processing liquid returned to the liquid supply unit through the circulation path is supplied to the first main surface. 基板处理装置具备保持部、液供给部、回收部、循环