Copper-clad plate, electronic component comprising same and manufacturing method of copper-clad plate

• Main Authors: PARK JONG-YONG, JEONG WOO-DEUK, CHUNG SEUNG-MO, KANG HYEONG-DAE, LEE HA-SOO, LEE YONG-HO
• Format: Patent
• Language: Chinese; English
• Published: 27.09.2022
• Subjects: ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CONDUCTORS; CORRECTING FLUIDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; FILLING PASTES; GENERAL PROCESSES OF COMPOUNDING; INKS; INSULATORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS THEREFOR; WOODSTAINS; WORKING-UP

The invention discloses a copper-clad plate, an electronic component comprising the same and a manufacturing method of the copper-clad plate. The copper-clad plate includes: a substrate structure in which a primer layer is provided on at least one surface of a substrate; and a copper-containing layer, which is provided on the base material structure, in which the copper-containing layer is formed on the base material structure by means of X-ray diffraction (X-ray diffraction); the ratio (I [200]/I [311]) of the peak intensity of the [200] azimuth plane to the peak intensity of the [311] azimuth plane of the copper-containing layer as analyzed by XRD may be equal to or greater than 2.0. The copper-clad plate has low dielectric constant, low dielectric loss and low surface roughness at high frequency, so that the copper-clad plate has low transmission loss, long fatigue life and high normal temperature adhesive force and heat-resistant adhesive force between the substrate structure and the copper-containing lay