SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

The embodiment of the invention mainly provides a semiconductor device which can improve reverse recovery characteristics of a built-in diode and is high in reliability and a manufacturing method thereof. According to one embodiment, a semiconductor device includes: an upper electrode; a lower elect...

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Bibliographic Details
Main Author OASA KOHEI
Format Patent
LanguageChinese
English
Published 27.09.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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