Semiconductor packaging structure and forming method thereof

• Main Authors: LIN BAIYAO, WANG JINHUA, LAI BAICHEN, YOU MINGZHI, ZHENG XINPU
• Format: Patent
• Language: Chinese; English
• Published: 23.09.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a semiconductor packaging structure and a forming method thereof. The semiconductor package structure includes a carrier substrate, an interposer substrate, a semiconductor device, a cover member, and a thermal interface material. The interposer substrate is disposed on the carrier substrate. The semiconductor device is disposed on the interposer substrate. The cover member is disposed on the carrier substrate to cover the semiconductor device. A thermal interface material is disposed between the cap and the semiconductor device. A first recess is formed on a lower surface of the cover member facing the semiconductor device and overlaps the semiconductor device in a plan view. 一种半导体封装结构及其形成方法。半导体封装结构包括一载体基板、一中介层基板、一半导体装置、一盖件以及一热界面材料。中介层基板设置在载体基板上。半导体装置设置在中介层基板上。盖件设置在载体基板上，以覆盖半导体装置。热界面材料设置在盖件与半导体装置之间。一第一凹部形成在盖件的面向半导体装置的一下表面上，且在俯视视角中，第一凹部与半导体装置重叠。